Picha | Nambari ya Sehemu | Maelezo | Hisa | Bei ya Kitengo | RFQ |
---|---|---|---|---|---|
DK-QCC5121-WLCSP81-A-0Qualcomm |
DEV KIT QCC5121 81WLCSP |
4 Katika Hisa $800.00000 |
|||
DK-QCC5124-VFBGA90-A-0Qualcomm |
DEV KIT, DK-QCC5124-VFBGA90-A-0, |
8 Katika Hisa $800.00000 |
|||
DB-QCC5127-VFBGA124-A-0Qualcomm |
DEV KIT DB-QCC5127-VFBG124-A-0 |
1,813,600 Katika Hisa $200.00000 |
|||
DK-CSR1011-10138-1AQualcomm |
EVAL KIT FOR CSR1011 |
9 Katika Hisa $299.00000 |
|||
DK-QCC5126-VFBGA90-A-0Qualcomm |
DEV KIT, DK-QCC5126-VFBGA90-A-0, |
16 Katika Hisa $800.00000 |
|||
DB-QCC5126-VFBGA90-A-0Qualcomm |
DEV KIT, DB-QCC5126-VFBGA90-A-0, |
20 Katika Hisa $200.00000 |
|||
DK-CSRB5342-10230-1AQualcomm |
EVAL KIT |
5 Katika Hisa $249.00000 |
|||
DK-QCC3002-WLCSP-CE751-1AQualcomm |
DEV KIT QC33002 WLCSP BT |
7 Katika Hisa $800.00000 |
|||
DK-CSR1024-10284-1AQualcomm |
NODE BOARD |
259,106 Katika Hisa $29.00000 |
|||
DB-QCC5120-VFBGA124-A-0Qualcomm |
DEV KIT QCC5120 MODULE ONLY |
6 Katika Hisa $200.00000 |
|||
DK-QCC3004-BGA-CE742-1AQualcomm |
DEV KIT QC33004 BGA BT |
6 Katika Hisa $800.00000 |
|||
30-Y8091-301Qualcomm |
DEVELOPMENT KIT: WB395-010, QCA9 |
302,312 Katika Hisa $98.75000 |
|||
DK-QCC5120-VFBGA124-A-0Qualcomm |
DEV KIT QCC5120 124VFBGA |
32 Katika Hisa $800.00000 |
|||
DB-QCC5125-VFBGA90-A-0Qualcomm |
DEV KIT QCC5125 MODULE ONLY |
906,985 Katika Hisa $200.00000 |
|||
DK-ENV_SENS-10224-1AQualcomm |
KIT ENERGY TEMP/PRESSUR4 SENSOR |
3 Katika Hisa $49.00000 |
|||
DK-8600-10145-1AQualcomm |
KIT DEV CSR8600 |
38 Katika Hisa $370.00000 |
|||
DEV-PC-1309CQualcomm |
BOARD PCB DEV SPI/UART INTERFACE |
16 Katika Hisa $93.75000 |
|||
DEV-SYS-1519-1BQualcomm |
KIT REF DESIGN BC4-ROM A07 |
2 Katika Hisa $286.00000 |
|||
30-Y9107-110Qualcomm |
DEVELOPMENT KIT: WB396-040, QCA9 |
604,747 Katika Hisa $98.75000 |
|||
30-Y9583-3Qualcomm |
DEVELOPMENT KIT: QCA4012.SP240.1 |
1 Katika Hisa $373.75000 |
Copyright © 2024 ZHONG HAI SHENG TECHNOLOGY LIMITED All Rights Reserved.
Taarifa ya Faragha | Masharti ya matumizi | Udhamini wa Ubora